Sincerely invite you to attend | 2024 China International Semiconductor Packaging and Testing Conference
Release time:
2024-03-13 11:26
Date:
March 18-19, 2024
Venue: Conference Hall on the first floor
of Shanghai Pudong Greenland Holiday Inn Organizer: China International Semiconductor Packaging and Testing Conference Organizing Committee Today's Semiconductor PCB Fusion New Media Chip Enterprise Check
The 2024 China International Semiconductor Packaging and Testing Conference is about to open! This is a grand event that brings together elites from the global semiconductor industry and an important platform for discussing future technological trends. The conference invited industry experts, scholars and entrepreneurs to discuss new technologies, cutting-edge trends and industry development directions in the field of semiconductor packaging and testing.
In 2024, the semiconductor industry is in a critical period of rapid development, and China's semiconductor industry is booming, showing strong innovation and competitiveness. This conference will bring together leading companies in the field of semiconductor packaging and testing at home and abroad to discuss how to promote innovation and breakthroughs in semiconductor packaging and testing technology and help China's semiconductor industry achieve greater development.
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